Currently there is the wish to minimize the energy costs as well as minimize the use of resources and so there is an enthusiasm to continue down this route of downgauging. I know of a number of metallizers that were designed for metallizing 12-micron to 25-micron packaging films that was the accepted range for packaging films in the era the systems were built that are now being used to coat films thinner than 12 microns.
Earlier this year, Treofan & Borealis won the Best Lightweight Innovation Award for their 1.9-micron BOPP ultra-thin film for capacitor applications. They developed a high-crystallinity, super-pure, high-isotactic polypropylene homo-polymer that enables the production of the thin 1.9-micron film with very good thickness homogeneity showing good electrical field stress performance, low energy losses, very good mechanical characteristics and increased thermal stability. The reduction of film thickness from 2.4 microns down to 1.9 microns gives a predicted improvement in efficiency of the metallized dry capacitor film of 30% through an increased storage capacity per unit area, reduced weight which requires reduced cooling and this all reduces the energy requirement and operating costs.
It is good to see that there are still opportunities for downgauging improvements even after more than 50 years of improvements.